G383-R80-AAP1

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HPC/AI Server - AMD Instinct™ MI300A APU - 3U 8-Bay Gen5 NVMe

# 人工智能平台 # 人工智能训练服务器 # 人工智能推理服务器 # 高性能计算平台

4 x AMD Instinct™ MI300A APUs
128GB HBM3 per APU
Dual ROM Architecture
2 x 10Gb/s LAN ports via Broadcom^® BCM57416
1 x M.2 slot with PCIe Gen5 x4 interface
8 x 2.5" Gen5 NVMe bays
4 x FHFL Dual slot PCIe Gen5 x16 slots
4 x FHFL Single slot PCIe Gen5 x16 slots
3+1 3000W 80 PLUS Titanium redundant power supplies

加入比较表

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U
447 x 131 x 950

Motherboard

MR83-AC0

APU

4 x AMD Instinct™ MI300A APUs
- 24 x Zen4 CPU cores per APU
- 228 x CDNA3 compute units per APU
- TDP up to 550W (CPU + GPU + memory)
- Peak up to 760W

Socket

4 x Socket SH5

Chipset

System on Chip

Memory

128GB HBM3 unified memory
Memory bandwidth 5.3TB/s

LAN

Front side:
2 x 10Gb/s LAN ports (1 x Broadcom^® BCM57416)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front side:
8 x 2.5" Gen5 NVMe bays

SAS

N/A

RAID

N/A

Expansion Slots

PCIe Cable x 8:
4 x PCIe x16 (Gen5 x16) FHFL slots (Dual slot)
4 x PCIe x16 (Gen5 x16) FHFL slots (Single slot)

1 x M.2 slot:
- M-key
- PCIe Gen5 x4, from APU_0
- Supports 2280/22110 cards

Internal I/O

1 x TPM header

Front I/O

2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

3+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

TBD

System Fans

2 x 60x60x56mm (25,700rpm)
8 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

TBD

Packaging Content

1 x G383-R80-AAP1
4 x APU heatsinks
1 x Mini-DP to D-Sub cable
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NG383R80DR000AAP1*
- Motherboard: 9MR83AC0UR-000
- L-shape Rail kit: 25HB2-A96100-K0R
- APU heatsink: 25ST1-553207-A3R/25ST1-553208-A3R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFPG040: 9CFPG040NR-00
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 60x60x56mm: 25ST2-665622-S1R
- Fan module 80x80x80mm: 25ST2-888026-S1R
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000R-G1S

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手册

Online Support

驱动程序

BIOS

工具程序

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

AMD Chipset Driver

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

G383-R80-AAP1

SPECIFICATIONS

SUPPORT

RESOURCES

G383-R80-AAP1