H223-Z10-AAP1

High Density Server - AMD EPYC™ 9004 - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe

2U 3-node front access server system
Single AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology) per node
12-Channel DDR5 RDIMM, 36 x DIMMs
Dual ROM Architecture
2 x CMC ports
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
3 x FHHL PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x16 slots
3 x OCP 3.0 Gen5 x16 slots
1+1 3000W 80 PLUS Titanium redundant power supplies

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* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 3-Node - Front access
447.8 x 87.5 x 500

Motherboard

MZ13-HD0

CPU

AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Single processor per node, 5nm technology
*Up to 128 cores, 256 threads
cTDP up to 240W at ambient 35°C

cTDP up to 300W at ambient 30°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Socket

Per Node:
1 x LGA 6096

Total:
3 x LGA 6096

Socket SP5

Chipset

System on Chip

Memory

Per node:
12 x DIMM slots

Total:
36 x DIMM slots

DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s

LAN

Total:
2 x CMC ports

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot

Riser Card CRSH01R:
- 1 x PCIe x16 (Gen5 x16) FHHL slot

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function

Optional 1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

Total:
Riser Card CRSH01Q x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots

Riser Card CRSH01R x 3:
- 3 x PCIe x16 (Gen5 x16) FHHL slots

3 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

Optional 3 x M.2 slots (CMTP192):
- M-key
- PCIe Gen4 x4
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header

Front I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x Power button with LED
1 x System status LED
1 x ID LED

Total:
6 x USB 3.2 Gen1
3 x VGA
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS / BMC / CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 17.4 kg
Gross Weight: 28.4 kg

Packaging Dimensions

857 x 670 x 280 mm

Packaging Content

1 x H223-Z10-AAP1
3 x CPU heatsinks
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH223Z10DR000AAP1*
- Motherboard: 9MZ13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- EDSFF riser card - CSPP010: 9CSPP010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- RMA packaging: 6NH223Z10SR-RMA-A100

SUPPORT

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驱动程序
BIOS
工具程序
Firmware

使用手册
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

AMD Chipset Driver

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

H223-Z10-AAP1

SPECIFICATIONS

SUPPORT

RESOURCES

H223-Z10-AAP1