H261-Z60

2U 4-Node - Rear access
440 x 87 x 820

MZ61-HD0 Rev. 3.0

AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 200W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Per Node:
2 x LGA 4094

Total:
8 x LGA 4094

Socket SP3

System on Chip

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200*/2933 MT/s

*Follow BIOS setting and memory QVL if running 3200 MT/s.

Per node:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management port

Total:
8 x 1Gb/s LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 CMC port

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Per node:
6 x 2.5" SATA hot-swappable bays
or
4 x 2.5" SATA/SAS hot-swappable bays with SAS RAID Card

Total:
24 x 2.5" hot-swappable bays

SAS card is required for SAS devices support

Depends on SAS add-in cards

Depends on SAS add-in cards

Per node:
2 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

Total:
8 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0

4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 120W if using M.2 device

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

• Dashboard
• JAVA Based Serial Over LAN
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• LDAP / AD / RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019 (x64)
Windows Server 2022 (x64)

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

1167 x 700 x 309 mm

1 x H261-Z60
8 x CPU heatsinks
1 x Rail kit

- Barebone package: 6NH261Z60MR-00-B*
- Motherboard: 9MZ61HD0NR-00 Rev. 3.0
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH0O0: 9CBPH0O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00