Dimensions (WxHxD, mm)
1U
438 x 43.5 x 900
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Memory
32 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to *5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
*5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.
LAN
Top side:
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Bottom side:
2 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
- (NVMe from CPU_0)
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
PCIe Cable x 4:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU_0, for GPUs
- 2 x PCIe x16 (Gen5 x16) FHFL slots, from CPU_1, for GPUs
- 1 x Internal PCIe x16 (Gen4 x8) low-profile slot, from CPU_0
Riser Card CRC1240:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_1
Riser Card CRS102B:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU_0, for GPUs
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU_0, occupied when Dual slot GPU is installed
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
Internal I/O
1 x TPM header
1 x VROC connector
Top I/O
2 x USB 3.2 Gen1
1 x Mini-DP
1 x MLAN
1 x ID LED
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
TPM
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010
Power Supply
Dual 2700W 80 PLUS Titanium redundant power supply
AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1008W/ 100-127V~
+12V/ 84A
+12Vsb/ 3A
- Max 2700W/ 200-240V~ or 240Vdc Input
+12V/ 225A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed
® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Operating Properties
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1173 x 773 x 243 mm
Packaging Content
1 x R183-SF2-IAL1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
2 x GPU power cables (12VHPWR, 400mm)
1 x GPU power cable (12VHPWR, 500mm)
1 x GPU power cable (12VHPWR, 650mm)
6 x Carriers
Part Numbers
- Barebone package: 6NR183SF2DR000IBL1*
- Motherboard: 9MSF3GP0UR-000
- CPU heatsink: 25ST1-4534Z0-S7R
- Backplane board - CBP2025: 9CBP2025NR-00
- Riser card - CRC1240: 9CRC1240NR-00
- Riser card - CRS102B: 9CRS102BNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (12VHPWR, 400mm): 25CRI-4003B1-Y4R
- GPU power cable (12VHPWR, 400mm): 25CRI-4003B2-Y4R
- GPU power cable (12VHPWR, 500mm): 25CRI-5003B1-Y4R
- GPU power cable (12VHPWR, 650mm): 25CRI-6503B0-Y4R
- Power supply: 25EP0-227001-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有*不相符之处,应以实际产品为准。技嘉科技保留在*时间做出修改之权利。对*因使用上述数据而引致之损失,技嘉科技概不承担*责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的*理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法*人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。