Dimensions (WxHxD, mm)
2U
438 x 87.5 x 730
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
TDP up to 270W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4189
Socket P+
Memory
32 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s
LAN
Rear side:
2 x 1Gb/s LAN ports (Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
Storage
Front side:
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x 3.5"/2.5" SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
Riser Card CRS2014:
- 1 x PCIe x16 (Gen4 x16) FHFL slot, from CPU_1, for GPUs
Riser Card CRS2026 x 2:
- 2 x PCIe x16 (Gen4 x16) FHFL slots, from CPU_0, for GPUs
- 2 x PCIe x16 (Gen4 x16) FHFL slots, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth, from CPU_1
Supports NCSI function
Internal I/O
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x Storage activity LED
2 x LAN activity LEDs
Rear I/O
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010
Power Supply
1+1 2400W 80 PLUS Platinum redundant power supplies (-100)
AC Input:
- 100-127V~/ 12.5A, 47-63Hz
- 180-200V~/ 14.5A, 47-63Hz
- 200-240V~/ 14.5A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 84A
+12Vsb/ 3A
- Max 2200W/ 180-200V~
+12V/ 180A
+12Vsb/ 3A
- Max 2400W/ 200-240V~ or 240Vdc Input
+12V/ 197A
+12Vsb/ 3A
1+1 2700W 80 PLUS Titanium redundant power supplies (-1T0)
AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1008W/ 100-127V~
+12V/ 84A
+12Vsb/ 3A
- Max 2700W/ 200-240V~ or 240Vdc Input
+12V/ 225A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed
® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
982 x 588 x 268 mm
Packaging Content
1 x R282-G30
2 x CPU heatsinks
2 x GPU power cables (CPU 8pin, 150mm)
1 x GPU power cable (CPU 8pin, 350mm)
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR282G30MR-00-1*
- Motherboard: 9MR92FS1NR-00
- 2-Section Rail kit (CMA not supported): 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-453204-M1R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP20C5: 9CBP20C5NR-00
- Fan module: 25ST2-883829-D0R
- Riser card - CRS2014: 9CRS2014NR-00
- Riser card - CRS2026: 9CRS2026NR-00
- GPU power cable (CPU 8pin, 350mm): 25CRI-350100-Y4R
- GPU power cable (CPU 8pin, 600mm): 25CRI-600100-Y4R
- Power supply (-100): 25EP0-224000-D0S
- Power supply (-1T0): 25EP0-227000-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- 3-Section Rail kit (Supports CMA): 25HB2-AA6105-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- RMA packaging: 6NR282G30SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有*不相符之处,应以实际产品为准。技嘉科技保留在*时间做出修改之权利。对*因使用上述数据而引致之损失,技嘉科技概不承担*责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的*理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法*人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。